Based upon each specific design application, a molded in place rib pattern made of Silver/Inert coated Aluminum in a Silicone base, can be applied to any metal substrate creating a multi-compartment shielded enclosure. During installation, the shield is sandwiched between one side of the printed circuit board and the housing. The mold-in-place rib enclosure design is ideally suited for portable devices where space is at a premium, hand held computers, and wireless communications devices. The Mold-In-Place PCB Shielding replaces multiple soldered printed circuit board shield cans with a single piece approach.